High-speed, high-efficiency III-V photonic devices powering optical and terahertz innovation.
Contact UsThe future of communication hinges on performance — bandwidth, responsivity, and energy efficiency. Our photodetectors break traditional trade-offs through structural and material innovation.
Using a disruptive MUTC design, we overcome hole transport bottlenecks, achieving over 200 GHz bandwidth per lane — while maintaining a responsivity of 0.8 A/W — enabling 400 Gbit/s per channel and beyond.
Our team deliver innovation across the full photonic device development flow, including epitaxial structure design, advanced III-V processing, ultrafast RF characterization, and broadband packaging up to 300 GHz. With years of accumulation in the design and fabrication III-V photodiodes , we have built a robust foundation for rapid product iteration and performance breakthroughs.
We provide high-frequency packaging technologies supporting signal integrity from DC up to terahertz bands. Our solutions ensure low loss, wide bandwidth, and excellent thermal and electrical performance — enabling reliable integration of ultrafast photonic devices into real-world systems.
We develop advanced integration techniques that combine the performance of III-V materials with the scalability of silicon photonics and the electro-optic efficiency of thin-film lithium niobate (TFLN), enabling next-generation photonic chips with unmatched speed and functionality.
Short-reach: 200G/400G per λ
Metro/DCI: ZR, ZR+ coherent
VCSEL-based solutions:
100Gbp per-lane and 200Gbps per-lane
Terahertz Communication
Microwave Photonics
Non-destructive Testing
FastPhide is at the forefront of photonic innovation, developing cutting-edge photodetector solutions that power the future of optical communications.
Our team combines deep expertise in III-V semiconductors, photonic integration, and advanced packaging to deliver breakthrough performance.
We collaborate extensively with leading academic institutions and industry partners to drive innovation in photonic technologies and accelerate the development of next-generation solutions.
Interested in partnering, investing, or learning more about our work? We're always open to bold ideas and ambitious collaborators.
Email: contact@fastphide-lab.com
Location: Shanghai, China